Classical architectural building with grand entrance and symmetrical wings at dusk

Ukraine, Kotsiubiiv, Kotsiubiiv O & B Theatre

Artist
Neo Kotsiu...
DDG Model
Artistic
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Public
Created
2yrs ago
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Public
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  Ukraine, Kotsiubiiv, Kotsiubiiv O & B Theatre
  
  Model: Artistic
  
  Size: 1024 X 576 (0.59 MP)
  
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  Prompt: While through-hole mounting provides strong mechanical bonds when compared to SMT techniques, the additional drilling required makes the boards more expensive to produce. They also limit the available routing area for signal traces on layers immediately below the top layer on multilayer boards since the holes must pass through all layers to the opposite side. To that end, through-hole mounting techniques are now usually reserved for bulkier or heavier components such as electrolytic capacitors or semiconductors in larger packages such as the TO-220 that require the additional mounting strength, or for components such as plug connectors or electromechanical relays that require great strength in support.
  
  Using base image: Yes
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Prompt: While through-hole mounting provides strong mechanical bonds when compared to SMT techniques, the additional drilling required makes the boards more expensive to produce. They also limit the available routing area for signal traces on layers immediately below the top layer on multilayer boards since the holes must pass through all layers to the opposite side. To that end, through-hole mounting techniques are now usually reserved for bulkier or heavier components such as electrolytic capacitors or semiconductors in larger packages such as the TO-220 that require the additional mounting strength, or for components such as plug connectors or electromechanical relays that require great strength in support.

Modifiers:

elegant extremely detailed intricate oil on canvas photorealistic beautiful high detail dynamic lighting hyperrealistic high definition crisp quality coherent serene graceful 4k HDR

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Prompt

While through-hole mounting provides strong mechanical bonds when compared to SMT techniques, the additional drilling required makes the boards more expensive to produce. They also limit the available routing area for signal traces on layers immediately below the top layer on multilayer boards since the holes must pass through all layers to the opposite side. To that end, through-hole mounting techniques are now usually reserved for bulkier or heavier components such as electrolytic capacitors or semiconductors in larger packages such as the TO-220 that require the additional mounting strength, or for components such as plug connectors or electromechanical relays that require great strength in support.